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Tokyo, July 14, 2011 - Effective August 1, Mitsubishi Heavy Industries, Ltd. (MHI) will establish a new department in Kobe, Japan, to be known as the.

Mitsubishi Heavy Industries, Ltd. (MHI) has developed a fully automated 8-inch wafer bonding machine that is capable of producing 3-dimensionally integrated LSI (large–scale integration) circuits at room temperature. ...

MHI Develops World's First 8-inch Wafer Bonding Machine to Produce 3-D Integrated LSI Circuits at Room Temperature.


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